Funny the way terminology works
June 8, 2004, 3:46 pm · Filed Under Uncategorized
There’s a particular type of component in electronics called a BGA. BGA stands for Ball Grid Array, and describes the way this “package” as they are called, is connected to a PCB - ie with small bits of solder. These can get very fine in pitch, ie distance from pad to pad, like 0.4mm.
Now, there is a rule of thumb that says the land (pad) for the solder ball (ball grid array) should be no larger than the ball itself.
I’m waiting for an engineer to ask what sizes pads he should use for a BGA, so I can say with a totally straight face “What size are your balls in your package?”
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